SIMDA SIMDA

Service

Precision Circuits, Rock Solid

From component selection to mass-production delivery, every circuit layer stands up to scrutiny

Core Highlights

Core Highlights

01

Schematic Design

Signal and power integrity analysis that eliminates mass-production risks at the source

02

PCB Layout

32-layer high-density interconnect, high-speed differential pair routing, full-spectrum EMC optimization

03

DFM

Yield-driven design that lifts mass-production yield from 85% to 98%+

04

Prototyping

One-stop loop of signal testing, environmental trials, and compliance certification

Specifications

Specifications

32 Layers
Max Layers
25 Gbps
Max Signal Rate
0.075 mm
Min Trace Width
200+
Projects Delivered
Process

Delivery Process

01

Requirement Confirmation

Four-dimensional alignment of scenario, specs, cost, and timeline

02

Schematic Design

Component selection and schematic with SI/PI simulation

03

Layout & Simulation

Routing, EMC, and thermal simulation iteration

04

Prototype Verification

Signal testing, environmental trials, and certification

Need This Service?

Tell our engineers your requirements and get a tailored solution within 3 business days

Consult Now